IoT | Wi-Fi 6 (802.11ax)

IWA66X

IWA66X is a high-performance Wi-Fi 6, BLE 5.4 and IEEE 802.15.4 module in LGA package launched by Eagle.
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IWA66X is a high-performance Wi-Fi 6, BLE 5.4 and IEEE 802.15.4 module in LGA package launched by Eagle.

  • IEEE 802.11 a/ b/ g/ n/ ac/ ax

  • Bluetooth 5.0 (BR/ EDR + BLE)

  • SDIO 3.0 Interface

  • USB 2.0 High Speed Interface

  • Ultra-compact Size

  • Operating Temperature Range: -40 °C to +85 °C

  • LGA Package

  • Thread

    Thread

  • Zigbee

    Zigbee

Temperature Range
Operating Temperature -40 °C to +85 °C
Storage Temperature -40 °C to +90 °C
Physical Rate (Max.)
802.11a 54 Mbps
802.11b 11 Mbps
802.11g 54 Mbps
802.11n 72.2 Mbps
802.11ac 86.7 Mbps
802.11ax 114.7 Mbps
Interfaces
Wi-Fi Antenna ① × 1 (4th generation RF coaxial connector, PCB antenna) (Optional)
Bluetooth/IEEE 802.15.4 Antenna × 1 (4th generation RF coaxial connector)
SDIO 3.0 ② × 1 (for Wi-Fi)
USB 2.0 ② × 1 (for Wi-Fi & Bluetooth)
UART ② × 1 (for Bluetooth)
SPI × 1 (for IEEE 802.15.4)
Electrical Features
Power Supply Voltage VBAT_3V3: 3.14–3.46 V, Typ. 3.3 V
I/O Power Supply Voltage VDDIO: • 3.14–3.46 V, Typ. 3.3 V • 1.71–1.89 V, Typ. 1.8 V
VDDIO_RF Power Supply VDDIO_RF: • 3.14–3.46 V, Typ. 3.3 V • 1.71–1.89 V, Typ. 1.8 V
SDIO_VDD Power Supply SDIO_VDD: • 3.14–3.46 V, Typ. 3.3 V • 1.71–1.89 V, Typ. 1.8 V
Power Consumption Typ. current at Tx mode: • 454.50 mA @ 3.3 V • 0.213 mA @ 1.8 V
Certifications
Regulatory (Planning) Europe: CE America: FCC China: SRRC

Key Features

  • 2.4 GHz/ 5 GHz Wi-Fi bands, BLE 5.4
  • IEEE 802.15.4 (Thread, Zigbee)
  • SDIO 3.0/ USB 2.0 interface that support higher data transmission
    rate and enable lower power consumption
  • Wide operating temperature range: -40 °C to +85 °C
  • 4th generation RF coaxial connector, PCB antenna (optional)

Product Description

IWA66X is a high-performance Wi-Fi 6, BLE 5.4 and IEEE 802.15.4 module in LGA package launched by Eagle. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 9 rates in a 20 MHz bandwidth with 256QAM supported. The module is designed with a reliable SDIO 3.0 or USB interface to provide WLAN capability. With an ultra-compact size of 23.0 mm × 14.0 mm × 2.2 mm, IWA66X optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications. Surface-mount Technology (SMT) makes IWA66X an ideal solution for durable and rugged designs.

The low profile and small size of LGA package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, IWA66X is suitable for a variety of smart home and industrial applications.

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